Invention Grant
- Patent Title: Laminated electronic component
- Patent Title (中): 层压电子部件
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Application No.: US12030282Application Date: 2008-02-13
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Publication No.: US08154849B2Publication Date: 2012-04-10
- Inventor: Tatsuo Kunishi , Yoshihiko Takano , Shigeyuki Kuroda , Akihiro Motoki , Hideyuki Kashio , Takashi Noji
- Applicant: Tatsuo Kunishi , Yoshihiko Takano , Shigeyuki Kuroda , Akihiro Motoki , Hideyuki Kashio , Takashi Noji
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co. Ltd.
- Current Assignee: Murata Manufacturing Co. Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Main IPC: H01G4/228
- IPC: H01G4/228

Abstract:
A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 μm or less, and a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 μm or less. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.
Public/Granted literature
- US20080123248A1 LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2008-05-29
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