Invention Grant
- Patent Title: Motherboard
- Patent Title (中): 母板
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Application No.: US11849306Application Date: 2007-09-03
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Publication No.: US08154879B2Publication Date: 2012-04-10
- Inventor: Chih-Hang Chao , Yu-Hsu Lin , Jeng-Da Wu
- Applicant: Chih-Hang Chao , Yu-Hsu Lin , Jeng-Da Wu
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200710201059 20070712
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/06 ; H05K7/08 ; H05K7/10

Abstract:
A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in the printed circuit board between the second chip and a first line determined by two of the securing holes close to the second chip. Should the printed circuit board suffer an impact, damage to the chips may be effectively minimized or prevented.
Public/Granted literature
- US20090016024A1 MOTHERBOARD Public/Granted day:2009-01-15
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