Invention Grant
- Patent Title: Radiation-shielded semiconductor assembly
- Patent Title (中): 辐射屏蔽半导体组件
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Application No.: US11939084Application Date: 2007-11-13
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Publication No.: US08154881B2Publication Date: 2012-04-10
- Inventor: Roydn Jones
- Applicant: Roydn Jones
- Applicant Address: US MD Annapolis
- Assignee: Telecommunication Systems, Inc.
- Current Assignee: Telecommunication Systems, Inc.
- Current Assignee Address: US MD Annapolis
- Agent William H. Bollman
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K9/00 ; H01L23/34
Abstract:
A radiation-shielded semiconductor assembly includes at least one radiation-shielding lamina within the package. In some embodiments, a semiconductor assembly includes a microelectronic component, and at least one radiation-shielding layer affixed to a surface of the component.
Public/Granted literature
- US20080112150A1 RADIATION-SHIELDED SEMICONDUCTOR ASSEMBLY Public/Granted day:2008-05-15
Information query
