Invention Grant
- Patent Title: Structure of a voice coil assembly
- Patent Title (中): 音圈组件的结构
-
Application No.: US12073747Application Date: 2008-03-10
-
Publication No.: US08155371B2Publication Date: 2012-04-10
- Inventor: Jia-Hroung Wu , Wen-Chi Fu , Wen-Lan Wu , Yi-Ta Tsai , Yong-Siang Chen , Hsiu-Hui Chu , Chyau-Wen Jiang , Yu-Jung Chen
- Applicant: Jia-Hroung Wu , Wen-Chi Fu , Wen-Lan Wu , Yi-Ta Tsai , Yong-Siang Chen , Hsiu-Hui Chu , Chyau-Wen Jiang , Yu-Jung Chen
- Applicant Address: TW Taichung County
- Assignee: Hsiuping Institute of Technology
- Current Assignee: Hsiuping Institute of Technology
- Current Assignee Address: TW Taichung County
- Agency: Rosenberg, Klein & Lee
- Main IPC: H04R1/00
- IPC: H04R1/00 ; H04R25/00
Abstract:
A structure of a voice coil assembly includes a plate, a top board, suspending arms and fixtures. The plate has a top and two opposite sides. The top board is disposed on the top of the plate. The suspending arms extend from the two sides of the plate and are connected to the fixtures. A pair of resilient sections is provided between the suspending arms and the fixtures. The resilient sections are formed in a curved, arcuate or wavy shape. The suspending arm has a cross-section in a flat shape.
Public/Granted literature
- US20090226027A1 Structure of a voice coil assembly Public/Granted day:2009-09-10
Information query
