Invention Grant
- Patent Title: Cover mechanism and electronic device using same
- Patent Title (中): 封盖机构和电子设备使用相同
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Application No.: US12233762Application Date: 2008-09-19
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Publication No.: US08155715B2Publication Date: 2012-04-10
- Inventor: Mu-Wen Yang , Chih-Chiang Chang , Hai-Shen Feng
- Applicant: Mu-Wen Yang , Chih-Chiang Chang , Hai-Shen Feng
- Applicant Address: CN ShenZhen, Guangdong Province HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN ShenZhen, Guangdong Province HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN200810301311 20080425
- Main IPC: H04M1/00
- IPC: H04M1/00

Abstract:
An electronic device (100) using a cover mechanism (30) to cover its hole (14) of its housing (10) is described. The cover mechanism includes a cover (20) and a locking structure (11). The cover has a latching portion (23) and a locking portion (21), both of which include a resilient part. The locking structure is configured for associating with the locking portion and the latching portion. Thus, the cover is latched to the housing to cover the hole by deforming the resilient parts. After the cover is unlatched from the housing by a sudden pulling force, the locking portion still physically connects to the locking structure. After the cover is unlatched from the housing by a normal pulling force, the locking portion has no physically relationship with the locking structure.
Public/Granted literature
- US20090270144A1 COVER MECHANISM AND ELECTRONIC DEVICE USING SAME Public/Granted day:2009-10-29
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