Invention Grant
- Patent Title: Support structure packaging
- Patent Title (中): 支撑结构包装
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Application No.: US12571798Application Date: 2009-10-01
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Publication No.: US08155775B2Publication Date: 2012-04-10
- Inventor: J. Samuel Batchelder
- Applicant: J. Samuel Batchelder
- Applicant Address: US MN Eden Prairie
- Assignee: Stratasys, Inc.
- Current Assignee: Stratasys, Inc.
- Current Assignee Address: US MN Eden Prairie
- Agency: Westman, Champlin & Kelly, P.A.
- Agent Brian R. Morrison
- Main IPC: G06F19/00
- IPC: G06F19/00 ; B29C45/76 ; B29C47/92 ; B28C1/14 ; B28C1/00 ; B28C3/00 ; B28C5/00
Abstract:
A method comprising building at least one three-dimensional model and a support structure using a layer-based additive technique, where the at least one three-dimensional model is at least partially encased in the support structure, and where the support structure functions as a shipping package for the at least one three-dimensional model.
Public/Granted literature
- US20100086721A1 SUPPORT STRUCTURE PACKAGING Public/Granted day:2010-04-08
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