Invention Grant
- Patent Title: Method of modeling residual stresses during laser cutting
- Patent Title (中): 激光切割期间残余应力建模方法
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Application No.: US12453873Application Date: 2009-05-26
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Publication No.: US08155933B2Publication Date: 2012-04-10
- Inventor: Bekir Sami Yilbas , Abul Fazal M. Arif
- Applicant: Bekir Sami Yilbas , Abul Fazal M. Arif
- Applicant Address: SA Dhahran
- Assignee: King Fahd University of Petroleum & Minerals
- Current Assignee: King Fahd University of Petroleum & Minerals
- Current Assignee Address: SA Dhahran
- Agent Richard C. Litman
- Main IPC: G06F17/50
- IPC: G06F17/50
Abstract:
The method of modeling residual stresses during laser cutting utilizes thermal diffusion and stress equations and a discretization numerical method to model temperature variation and residual stresses in a substrate material due to laser cutting therethrough of small-diameter holes.
Public/Granted literature
- US20100305910A1 Method of modeling residual stresses during laser cutting Public/Granted day:2010-12-02
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