Invention Grant
- Patent Title: MEMS microphone with cavity and method therefor
- Patent Title (中): 具有腔体的MEMS麦克风及其方法
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Application No.: US12432377Application Date: 2009-04-29
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Publication No.: US08158492B2Publication Date: 2012-04-17
- Inventor: Lianjun Liu , Douglas G. Mitchell
- Applicant: Lianjun Liu , Douglas G. Mitchell
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agent James L. Clingan, Jr.; Daniel D. Hill
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A device comprises a substrate, a micro electro-mechanical systems (MEMS) structure, and a dielectric film. The substrate has a first side and a second side, the second side opposite the first side. The MEMS structure is formed on the first side of the substrate. The cavity is formed in the substrate directly opposite the MEMS structure. The cavity has an opening formed on the second side. The dielectric film is attached to the second side of the substrate and completely covering the opening. In one embodiment, the MEMS structure is a diaphragm for a microphone. Another embodiment includes a method for forming the device.
Public/Granted literature
- US20100276767A1 MEMS MICROPHONE WITH CAVITY AND METHOD THEREFOR Public/Granted day:2010-11-04
Information query
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