Package for an electronic device

Invention Grant

US08159056B1 Package for an electronic device 有权

Title translation: 电子设备的包装

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Patent Title: Package for an electronic device
Patent Title (中): 电子设备的包装
Application No.: US12014665

Application Date: 2008-01-15
Publication No.: US08159056B1

Publication Date: 2012-04-17
Inventor: Sangchae Kim , Steven Crist
Applicant: Sangchae Kim , Steven Crist
Applicant Address: US NC Greensboro
Assignee: RF Micro Devices, Inc.
Current Assignee: RF Micro Devices, Inc.
Current Assignee Address: US NC Greensboro
Agency: Withrow & Terranova, P.L.L.C.
Main IPC: H01L23/02
IPC: H01L23/02

Abstract:

A method of forming a device is provided. A substrate having a component is provided and a sacrificial layer is formed over the component. The sacrificial layer includes a cavity portion disposed about the component and a tunnel portion adjacent to the cavity portion. In addition, an encapsulation layer having a cover portion and a perimeter portion is formed over the sacrificial layer. The cover portion encapsulates the cavity portion such that the cavity portion forms a cavity within the cover portion. The perimeter portion is disposed over the tunnel portion. Moreover, an access hole is formed in the perimeter portion of the encapsulation layer.

Abstract(Chinese):

提供了一种形成装置的方法。提供具有部件的基板，并在该部件上形成牺牲层。牺牲层包括围绕部件设置的空腔部分和与空腔部分相邻的隧道部分。此外，在牺牲层之上形成具有盖部分和周边部分的封装层。盖部分封装空腔部分，使得空腔部分在盖部分内形成空腔。周边部分设置在隧道部分上。此外，在封装层的周边部分形成有通孔。

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/02	.容器；封接（H01L23/12，H01L23/34，H01L23/48，H01L23/552优先）