Invention Grant
- Patent Title: Backlight module assembling apparatus
- Patent Title (中): 背光模块组装装置
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Application No.: US12913783Application Date: 2010-10-28
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Publication No.: US08161629B2Publication Date: 2012-04-24
- Inventor: I-Thun Lin
- Applicant: I-Thun Lin
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99113583A 20100428
- Main IPC: B23P19/00
- IPC: B23P19/00

Abstract:
A backlight module assembling apparatus for attaching a reflector plate to a driving circuit board is disclosed. The backlight module assembling apparatus includes an assembling portion and a pressing movably connected to the assembling portion. The assembling portion defines a receiving space configured for receiving and positioning a driving circuit board therein. The assembling portion includes a top plate and a first opening defined in the top plate. The first opening communicates with the receiving space. The assembling portion includes a number of blades arranged around the first opening for cutting a reflector plate. The pressing portion includes a pressing plate. The pressing plate is movable toward and away from the blade and configured for pressing the reflector plate against the blades thus allowing the blades cutting the reflector plate to a shape conforming to the first opening and attaching the reflector plate to the driving circuit board.
Public/Granted literature
- US20110265317A1 BACKLIGHT MODULE ASSEMBLING APPARATUS Public/Granted day:2011-11-03
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