Invention Grant
- Patent Title: Heat pipe structure and flattened heat pipe structure
- Patent Title (中): 热管结构和扁平热管结构
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Application No.: US12116216Application Date: 2008-05-07
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Publication No.: US08162036B2Publication Date: 2012-04-24
- Inventor: Wei-Chung Hsiao , Hsuan-Cheng Wang , Chi-Wei Tien
- Applicant: Wei-Chung Hsiao , Hsuan-Cheng Wang , Chi-Wei Tien
- Applicant Address: TW Taipei
- Assignee: Compal Electronics, Inc.
- Current Assignee: Compal Electronics, Inc.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW97100549A 20080107
- Main IPC: F28D15/02
- IPC: F28D15/02

Abstract:
A heat pipe structure including a pipe body and a working substance is provided. The pipe body has two closed ends opposite to each other, an inner surface, a compressed portion, and an expanded portion. The inner surface and the two closed ends form a cavity. The compressed portion includes a plurality of first grooves formed at the inner surface. Any one of the first grooves includes a first width. The expanded portion includes a plurality of second grooves formed at the inner surface. Any one of the second grooves includes a second width, and the first width is approximately equal to the second width. The working substance is contained in the cavity.
Public/Granted literature
- US20090173475A1 HEAT PIPE STRUCTURE AND FLATTENED HEAT PIPE STRUCTURE Public/Granted day:2009-07-09
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