Invention Grant
- Patent Title: Injection molding die
- Patent Title (中): 注塑模具
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Application No.: US12598896Application Date: 2008-04-23
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Publication No.: US08162658B2Publication Date: 2012-04-24
- Inventor: Osamu Nakata , Mitsuhiro Takayama
- Applicant: Osamu Nakata , Mitsuhiro Takayama
- Applicant Address: JP Ube-shi
- Assignee: Central Glass Company, Limited
- Current Assignee: Central Glass Company, Limited
- Current Assignee Address: JP Ube-shi
- Agency: Crowell & Moring LLP
- Priority: JP2007-122325 20070507; JP2007-122362 20070507; JP2007-122363 20070507; JP2007-122364 20070507
- International Application: PCT/JP2008/057833 WO 20080423
- International Announcement: WO2008/139868 WO 20081120
- Main IPC: B29C45/32
- IPC: B29C45/32
Abstract:
There is provided an injection die characterized in that the injection die is separated into at least two pieces, that a cavity for frame is formed between the separated dies, that the cavity for frame is provided with an additional cavity via a coupling hole, and that the coupling hole communicating with the additional cavity is provided at a confluence point of a resin in melted condition of the cavity for frame, at around a gate, at around a cavity for a fixing component, or at around a cavity for frame of which thickness is deep.
Public/Granted literature
- US20100086637A1 Injection Molding Die Public/Granted day:2010-04-08
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