Invention Grant
- Patent Title: Surface grinding machine, spindle device and surface grinding method
- Patent Title (中): 平面磨床,主轴装置及表面磨削方式
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Application No.: US12157467Application Date: 2008-06-11
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Publication No.: US08162721B2Publication Date: 2012-04-24
- Inventor: Hideto Kitatsuji , Tomohiro Okamoto
- Applicant: Hideto Kitatsuji , Tomohiro Okamoto
- Applicant Address: JP Osaka
- Assignee: Koyo Machine Industries Co., Ltd.
- Current Assignee: Koyo Machine Industries Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Jordan and Hamburg LLP
- Priority: JP2007-153703 20070611
- Main IPC: B24B1/00
- IPC: B24B1/00

Abstract:
In through-feed grinding workpieces by grinding stones rotating around the axes of spindles, the spindles are tiltably held by elastic holding means around tilt axes substantially orthogonal to the direction of exit and entrance of the workpieces with respect to the grinding stones. When a grinding loads are imposed on the entrance sides of the grinding stones, the spindles are tilted by offset loads around the tilt axes against the force of urging means in such a manner that the axial displacement and the exit displacement of the grinding stone due to the offset load are substantially the same. The grinding stones are reset around the tilt axes by the elastic holding means immediately before the end of processing at which time the axial displacement is smaller. This makes it possible to reduce the number of defectively ground articles coming from the through-feed grinding and reduce the wear in the grinding stones.
Public/Granted literature
- US20080305724A1 Surface grinding machine, spindle device and surface grinding method Public/Granted day:2008-12-11
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