Invention Grant
- Patent Title: System for implanting an implant and method thereof
- Patent Title (中): 用于植入植入物的系统及其方法
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Application No.: US10093398Application Date: 2002-03-07
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Publication No.: US08162816B2Publication Date: 2012-04-24
- Inventor: Barry N. Gellman , Jianmin Li , Armand Morin , Jozef Slanda , Richard C. Tah
- Applicant: Barry N. Gellman , Jianmin Li , Armand Morin , Jozef Slanda , Richard C. Tah
- Applicant Address: US MN Maple Grove
- Assignee: Boston Scientific Scimed, Inc.
- Current Assignee: Boston Scientific Scimed, Inc.
- Current Assignee Address: US MN Maple Grove
- Agency: Bingham McCutchen LLP
- Main IPC: A61F2/00
- IPC: A61F2/00
Abstract:
A system for implanting an implant and method thereof is disclosed. In general overview, the system includes an implant, an envelope enclosing the implant, a delivery assembly and an attachment piece for attaching the envelope or implant to the delivery assembly. The envelope may include a drug coating, positioning aids, and means to ease envelope removal. In one embodiment, the delivery assembly is employed for implant and/or envelope delivery inside the patient's body. In another embodiment, the delivery assembly and an attachment piece are employed to deliver the implant or the envelope inside the patient's body.
Public/Granted literature
- US20020151909A1 System for implanting an implant and method thereof Public/Granted day:2002-10-17
Information query
IPC分类:
