Invention Grant
- Patent Title: Percutaneous instrument assembly
- Patent Title (中): 经皮仪器组装
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Application No.: US11737819Application Date: 2007-04-20
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Publication No.: US08162952B2Publication Date: 2012-04-24
- Inventor: Dan S. Cohen , Nicholas J. Bender , Oliver Buchert , Rui J. Ferreira
- Applicant: Dan S. Cohen , Nicholas J. Bender , Oliver Buchert , Rui J. Ferreira
- Applicant Address: US NJ Parsippany
- Assignee: EBI, LLC
- Current Assignee: EBI, LLC
- Current Assignee Address: US NJ Parsippany
- Agency: Harness, Dickey
- Main IPC: A61F2/00
- IPC: A61F2/00

Abstract:
An instrument for multi-level percutaneous spinal procedures. The instrument can include a curved rack having length adapted for at least substantially spanning first and second vertebrae and one or more intermediate vertebrae between the first and second vertebrae. The instrument can include first and second towers correspondingly engageable with the first and second vertebrae, and one or more intermediate towers engageable with the intermediate vertebrae. Further, the instrument can include first and second arms adapted for movably connecting the first and second towers to the rack, and one or more intermediate arms adapted for movably connecting the intermediate tower to the rack.
Public/Granted literature
- US20080077138A1 PERCUTANEOUS INSTRUMENT ASSEMBLY Public/Granted day:2008-03-27
Information query
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