Invention Grant
- Patent Title: Subsystems and methods for use in patch clamp systems
- Patent Title (中): 用于膜片钳系统的子系统和方法
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Application No.: US12328451Application Date: 2008-12-04
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Publication No.: US08163147B2Publication Date: 2012-04-24
- Inventor: Yokichi J. Tanaka
- Applicant: Yokichi J. Tanaka
- Applicant Address: US CA Foothill Ranch
- Assignee: Tecella LLC
- Current Assignee: Tecella LLC
- Current Assignee Address: US CA Foothill Ranch
- Agency: Goodwin Procter LLP
- Main IPC: G01N33/487
- IPC: G01N33/487
Abstract:
Subsystems and methods for use in patch clamp systems are provided. For example, in certain embodiments, compensation circuitry is used to compensate for non-idealities present in the patch clamp system. The accuracy of this compensation may be verified by employing, for example, circuitry that models the patch clamp system.
Public/Granted literature
- US20090078589A1 SUBSYSTEMS AND METHODS FOR USE IN PATCH CLAMP SYSTEMS Public/Granted day:2009-03-26
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