Invention Grant
- Patent Title: Formation of close-packed sphere arrays in V-shaped grooves
- Patent Title (中): 在V形槽中形成紧密堆积的球形阵列
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Application No.: US12795318Application Date: 2010-06-07
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Publication No.: US08163374B2Publication Date: 2012-04-24
- Inventor: Peng-Wei Chuang , Caroline A. Ross
- Applicant: Peng-Wei Chuang , Caroline A. Ross
- Applicant Address: US MA Cambridge
- Assignee: Massachusetts Institute of Technology
- Current Assignee: Massachusetts Institute of Technology
- Current Assignee Address: US MA Cambridge
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: B32B3/28
- IPC: B32B3/28 ; B32B3/30

Abstract:
The present invention relates to the self-assembly of a spherical-morphology block copolymer into V-shaped grooves of a substrate. Although spherical morphology block copolymers typically form a body-centered cubic system (bcc) sphere array in bulk, the V-shaped grooves promote the formation of a face-centered cubic system (fcc) sphere array that is well ordered. In one embodiment, the (111) planes of the fcc sphere array are parallel to the angled side walls of the V-shaped groove. The (100) plane of the fcc sphere array is parallel to the top surface of the substrate, and may show a square symmetry among adjacent spheres. This square symmetry is unlike the hexagonal symmetry seen in monolayers of spherical domains and is a useful geometry for lithography applications, especially those used in semiconductor applications.
Public/Granted literature
- US20100239819A1 FORMATION OF CLOSE-PACKED SPHERE ARRAYS IN V-SHAPED GROOVES Public/Granted day:2010-09-23
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