Invention Grant
US08163460B2 Underlayer coating forming composition for lithography containing polysilane compound 有权
用于含聚硅烷化合物的光刻用底层涂料组合物

Underlayer coating forming composition for lithography containing polysilane compound
Abstract:
There is provided an underlayer coating for lithography that is used in lithography process of the manufacture of semiconductor devices, that can be used as a hardmask, and that causes no intermixing with photoresists; and a composition for forming the underlayer coating.The composition comprises a polysilane compound, a crosslinkable compound, a crosslinking catalyst and a solvent. The polysilane compound is preferably a polysilane compound having a bond between silicons at the main chain.
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