Invention Grant
- Patent Title: Methods for discretized processing and process sequence integration of regions of a substrate
- Patent Title (中): 离散化处理方法和基板区域的工艺顺序整合
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Application No.: US13246045Application Date: 2011-09-27
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Publication No.: US08163631B2Publication Date: 2012-04-24
- Inventor: Tony P. Chiang , David E. Lazovsky , Thomas R. Boussie , Alexander Gorer
- Applicant: Tony P. Chiang , David E. Lazovsky , Thomas R. Boussie , Alexander Gorer
- Applicant Address: US CA San Jose
- Assignee: Intermolecular, Inc.
- Current Assignee: Intermolecular, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H01L21/20
- IPC: H01L21/20
Abstract:
The present invention provides methods and systems for discretized, combinatorial processing of regions of a substrate such as for the discovery, implementation, optimization, and qualification of new materials, processes, and process sequence integration schemes used in integrated circuit fabrication. A substrate having an array of differentially processed regions thereon is processed by delivering materials to or modifying regions of the substrate.
Public/Granted literature
- US20120021553A1 METHODS FOR DISCRETIZED PROCESSING AND PROCESS SEQUENCE INTEGRATION OF REGIONS OF A SUBSTRATE Public/Granted day:2012-01-26
Information query
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