Invention Grant
- Patent Title: Electronic component, lead-wire and their production methods
- Patent Title (中): 电子元件，导线及其制作方法
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Application No.: US12597309Application Date: 2008-07-01
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Publication No.: US08163997B2Publication Date: 2012-04-24
- Inventor: Kouhei Harazono , Hiroshi Kurimoto , Douyuu Hachisu , Takanao Saitou , Masami Kobayashi
- Applicant: Kouhei Harazono , Hiroshi Kurimoto , Douyuu Hachisu , Takanao Saitou , Masami Kobayashi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Pearne & Gordon LLP
- Priority: JP2007-187913 20070719; JP2008-038244 20080220
- International Application: PCT/JP2008/001721 WO 20080701
- International Announcement: WO2009/011096 WO 20090122
- Main IPC: H01G9/10
- IPC: H01G9/10
Abstract:
A lead-wire includes a led-out electrode made of metal and a cap. The cap is put over an end of the led-out electrodes, and is made of metal harder than the metal forming the led-out electrodes. An electronic component includes a functional element and the lead-wire. The led-out electrodes is led out of the functional element.
Public/Granted literature
- US20100108358A1 ELECTRONIC COMPONENT, LEAD-WIRE AND THEIR PRODUCTION METHODS Public/Granted day:2010-05-06
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