Invention Grant
- Patent Title: Insulation-coated wire
- Patent Title (中): 绝缘包线
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Application No.: US12427323Application Date: 2009-04-21
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Publication No.: US08163999B2Publication Date: 2012-04-24
- Inventor: Tomiya Abe , Yuki Honda , Dai Ishikawa
- Applicant: Tomiya Abe , Yuki Honda , Dai Ishikawa
- Applicant Address: JP Tokyo
- Assignee: Hitachi Cable, Ltd.
- Current Assignee: Hitachi Cable, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2008-281422 20081031
- Main IPC: H01B7/00
- IPC: H01B7/00
Abstract:
An insulation-coated wire has a conductor, and a semiconductive layer provided at an outer periphery of the conductor. The semiconductive layer has a resin coating including metal fine particles dispersed in a base resin, in which an average particle diameter of the metal fine particles is not greater than 1 μm.
Public/Granted literature
- US20100108356A1 INSULATION-COATED WIRE Public/Granted day:2010-05-06
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