Invention Grant
- Patent Title: Flexible printed circuit boards including carbon nanotube bundles
- Patent Title (中): 包括碳纳米管束的柔性印刷电路板
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Application No.: US12135849Application Date: 2008-06-09
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Publication No.: US08164000B2Publication Date: 2012-04-24
- Inventor: Tso-Hung Yeh , Hung-Yi Chang , Shing-Tza Liou
- Applicant: Tso-Hung Yeh , Hung-Yi Chang , Shing-Tza Liou
- Applicant Address: TW Tayuan, Taoyuan
- Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee: Zhen Ding Technology Co., Ltd.
- Current Assignee Address: TW Tayuan, Taoyuan
- Agency: Altis Law Group, Inc.
- Priority: CN200710075616 20070803
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A flexible printed circuit board base film for flexible printed circuit boards includes a sheet of flexible polymer matrix and a number of carbon nanotube bundles embedded in the polymer matrix. Each of the nanotubes bundles are spaced apart from each other. The flexible polymer matrix includes a first surface and a second surface. Due to the high thermal conductivity of carbon nanotubes, heat can be efficiently conducted from the first surface to the second surface of the flexible printed circuit board base film. The present invention also provides a flexible laminate made from the flexible printed circuit board base film and a flexible printed circuit boards made from the flexible laminate.
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