Invention Grant
- Patent Title: Semiconductor device with hetero semiconductor region and method of manufacturing the same
- Patent Title (中): 具有异质半导体区域的半导体器件及其制造方法
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Application No.: US12065847Application Date: 2006-08-22
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Publication No.: US08164116B2Publication Date: 2012-04-24
- Inventor: Tetsuya Hayashi , Yoshio Shimoida , Masakatsu Hoshi , Hideaki Tanaka , Shigeharu Yamagami
- Applicant: Tetsuya Hayashi , Yoshio Shimoida , Masakatsu Hoshi , Hideaki Tanaka , Shigeharu Yamagami
- Applicant Address: JP Yokohama-shi
- Assignee: Nissan Motor Co., Ltd.
- Current Assignee: Nissan Motor Co., Ltd.
- Current Assignee Address: JP Yokohama-shi
- Agency: Foley & Lardner LLP
- Priority: JP2005-263313 20050912; JP2006-122197 20060426; JP2006-136144 20060516
- International Application: PCT/JP2006/316806 WO 20060822
- International Announcement: WO2007/032197 WO 20070322
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device includes: a semiconductor base; a hetero semiconductor region which is in contact with the semiconductor base and which has a band gap different from that of the semiconductor base; a first electrode connected to the hetero semiconductor region; and a second electrode forming an ohmic contact to the semiconductor base. The hetero semiconductor region includes a laminated hetero semiconductor region formed by laminating a plurality of semiconductor layers in which crystal alignment is discontinuous at a boundary between at least two layers.
Public/Granted literature
- US20090278169A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-11-12
Information query
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