Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12720180Application Date: 2010-03-09
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Publication No.: US08164144B2Publication Date: 2012-04-24
- Inventor: Yoji Kitano
- Applicant: Yoji Kitano
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2009-073815 20090325
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/782

Abstract:
A semiconductor device includes a semiconductor layer on an insulating layer, and a first partially depleted transistor and a first diode in the semiconductor layer. The first transistor has a first gate electrode above the semiconductor layer via an insulating film and a first source or drain of a first conductivity type in the semiconductor layer below both sides of the gate electrode. The first diode has a first impurity layer of a second conductivity type in a shallow portion of the semiconductor layer and a second impurity layer of the first conductivity type in a deep portion of the semiconductor layer. The first and second impurity layers are stacked in a depth direction of the semiconductor layer. The side surfaces of the first and second impurity layers contact the semiconductor layer just below the first gate electrode.
Public/Granted literature
- US20100244134A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2010-09-30
Information query
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