Invention Grant
- Patent Title: Cooling devices in semiconductor packages
- Patent Title (中): 半导体封装中的冷却装置
-
Application No.: US12917157Application Date: 2010-11-01
-
Publication No.: US08164169B2Publication Date: 2012-04-24
- Inventor: Gregory M. Chrysler , Tony A. Opheim
- Applicant: Gregory M. Chrysler , Tony A. Opheim
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agent John N. Greaves
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A plurality of devices is attached to underside of the base plate. The devices have length corresponding to the height such that the devices are sealed within the cover when the cover is attached to a surface.
Public/Granted literature
- US20110135015A1 COOLING DEVICES IN SEMICONDUCTOR PACKAGES Public/Granted day:2011-06-09
Information query
IPC分类:
