Invention Grant
- Patent Title: Electronic component module and method for production thereof
- Patent Title (中): 电子元件模块及其制造方法
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Application No.: US12522849Application Date: 2007-01-10
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Publication No.: US08164177B2Publication Date: 2012-04-24
- Inventor: Richard Matz , Ruth Männer , Steffen Walter
- Applicant: Richard Matz , Ruth Männer , Steffen Walter
- Applicant Address: DE München
- Assignee: OSRAM AG
- Current Assignee: OSRAM AG
- Current Assignee Address: DE München
- Agency: Cozen O'Connor
- International Application: PCT/EP2007/050208 WO 20070110
- International Announcement: WO2008/083853 WO 20080717
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
An electronic component module comprising at least one ceramic circuit carrier (2, 3) and a cooling device with at least one heat sink (4), a bonding region arranged between the ceramic circuit carrier (2, 3) and the cooling device adapted for bonding the circuit carrier (2, 3) to the cooling device (4). The bonding region (5, 7; 6, 8) comprises a bonding layer comprised of metal and a eutectic region (7, 8).
Public/Granted literature
- US20100014253A1 Electronic Component Module and Method for Production Thereof Public/Granted day:2010-01-21
Information query
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