Invention Grant
- Patent Title: Functional element package and fabrication method therefor
- Patent Title (中): 功能元件封装及其制造方法
-
Application No.: US12531552Application Date: 2008-03-17
-
Publication No.: US08164180B2Publication Date: 2012-04-24
- Inventor: Yukito Sato , Joerg Froemel
- Applicant: Yukito Sato , Joerg Froemel
- Applicant Address: JP Tokyo DE Munich
- Assignee: Ricoh Company, Ltd.,Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
- Current Assignee: Ricoh Company, Ltd.,Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
- Current Assignee Address: JP Tokyo DE Munich
- Agency: Cooper & Dunham LLP
- Priority: JP2007-070292 20070319; JP2008-013249 20080124
- International Application: PCT/JP2008/055347 WO 20080317
- International Announcement: WO2008/123165 WO 20081016
- Main IPC: H01L29/84
- IPC: H01L29/84
Abstract:
A functional element package includes a silicon substrate with a functional element having one of a mobile portion and a sensor thereon; a seal member being bonded with the silicon substrate to form an airtightly sealed space therein, and including a step portion in its height direction; a first wiring portion being connected with the functional element and extending from the airtightly sealed space to an outside thereof; a second wiring portion being different from the first wiring portion and extending from the step portion to an upper surface of the seal member; and a bump on the second wiring portion, in which the first wiring portion is bent towards the airtightly sealed space and connected via a photoconductive member with the second wiring portion on the step portion.
Public/Granted literature
- US20100072562A1 FUNCTIONAL ELEMENT PACKAGE AND FABRICATION METHOD THEREFOR Public/Granted day:2010-03-25
Information query
IPC分类:
