Invention Grant
- Patent Title: Light-emitting device and manufacturing method thereof
- Patent Title (中): 发光元件及其制造方法
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Application No.: US11987177Application Date: 2007-11-28
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Publication No.: US08164254B2Publication Date: 2012-04-24
- Inventor: Tsukasa Maruyama , Tetsuya Ikuta
- Applicant: Tsukasa Maruyama , Tetsuya Ikuta
- Applicant Address: JP Tokyo
- Assignee: Dowa Electronics Materials Co., Ltd.
- Current Assignee: Dowa Electronics Materials Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rader, Fishman & Grauer PLLC
- Priority: JP2006-320149 20061128
- Main IPC: H01J1/62
- IPC: H01J1/62

Abstract:
A light-emitting device of the present invention includes: a light-emitting element; and a phosphor layer containing phosphors that absorb light from the light-emitting element and wavelength-convert the absorbed light to emit light. The phosphor layer has a structure in which the phosphors are disposed on an applied adhesive with a thickness equal to or less than an average particle size of the phosphors. A thickness of the phosphor layer is equal to or less than five times the average particle size of the phosphors, and an occupancy ratio of the phosphors in the phosphor layer is 50% or more. Further, the phosphors disposed on the adhesive has an adjusted particle size.
Public/Granted literature
- US20080150416A1 Light-emitting device and manufacturing method thereof Public/Granted day:2008-06-26
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