Invention Grant
US08164356B2 Testing apparatus and method for testing a semiconductor devices array
有权
用于测试半导体器件阵列的测试装置和方法
- Patent Title: Testing apparatus and method for testing a semiconductor devices array
- Patent Title (中): 用于测试半导体器件阵列的测试装置和方法
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Application No.: US12489040Application Date: 2009-06-22
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Publication No.: US08164356B2Publication Date: 2012-04-24
- Inventor: Chih Hui Yeh
- Applicant: Chih Hui Yeh
- Applicant Address: CN Taiwan
- Assignee: Nanya Technology Corp.
- Current Assignee: Nanya Technology Corp.
- Current Assignee Address: CN Taiwan
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Priority: TW97149649A 20081219
- Main IPC: G01R31/26
- IPC: G01R31/26 ; G01R31/3187

Abstract:
A testing apparatus and a method for testing a semiconductor devices array, which includes a plurality of rows and a plurality of columns, are provided. The testing apparatus includes a first testing circuit and a second testing circuit. The first testing circuit connects and transmits a clock signal, an input command signal and a data signal to at least one of the rows of the semiconductor devices array. The second testing circuit connects and transmits a selecting signal to at least one of the columns of the semiconductor devices array. Between two devices in a row, a difference in arrival times of the clock signal, a difference in arrival times of the input command signal, and a difference in arrival times of the data signal are equal.
Public/Granted literature
- US20100156452A1 TESTING APPARATUS AND METHOD FOR TESTING A SEMICONDUCTOR DEVICES ARRAY Public/Granted day:2010-06-24
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