Invention Grant
- Patent Title: Coil component
- Patent Title (中): 线圈组件
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Application No.: US12801176Application Date: 2010-05-26
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Publication No.: US08164409B2Publication Date: 2012-04-24
- Inventor: Takashi Kudo , Masatoshi Shindoh , Yuu Okabe , Hiroki Kobayashi , Takashi Kudo
- Applicant: Takashi Kudo , Masatoshi Shindoh , Yuu Okabe , Hiroki Kobayashi , Takashi Kudo
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2009-157852 20090702; JP2009-187108 20090812
- Main IPC: H01F27/02
- IPC: H01F27/02 ; H01F27/24

Abstract:
A coil component ensuring adhesive bonding between first and second cores. The coil component also includes an inductive component and a pair of terminal electrodes. The first core has a first adhesion surface. The second core is connected to the first core by an adhesive agent and has a second adhesion surface in confrontation with the first adhesion surface. At least one of the first adhesion surface and the second adhesion surface is formed of a glass surface layer to which the adhesive agent is applied. The inductive component is wound over the first core. The pair of terminal electrodes are provided at one of the first core and the second core. The inductive component has one end portion electrically connected to one of the terminal electrodes and has another end portion electrically connected to remaining one of the terminal electrodes.
Public/Granted literature
- US20110001595A1 Coil component Public/Granted day:2011-01-06
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