An camera module includes a substrate, an image sensor chip, and a lens module. The image sensor chip is disposed on and electrically connected to the substrate. The lens module is mounted on the base via an adhesive layer. The lens module includes a bottom surface contacting with the substrate. The bottom surface defines at least one sloped surfaces thereon. At least one gap is defined between the substrate and the at least one sloped surface. The adhesive layer is disposed between the bottom surface and the substrate, the gap is capable of accepting adhesive when the lens module and substrate are pressed together.