Invention Grant
- Patent Title: Alignment apparatus for aligning multi-layer structures
- Patent Title (中): 用于对准多层结构的对准装置
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Application No.: US12421712Application Date: 2009-04-10
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Publication No.: US08164752B2Publication Date: 2012-04-24
- Inventor: Hsin-Hung Chuang
- Applicant: Hsin-Hung Chuang
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200810301050 20080411
- Main IPC: G01B11/00
- IPC: G01B11/00

Abstract:
An exemplary alignment apparatus can align a first layer with a second layer. The first layer has a first alignment pattern. The second layer has a second alignment pattern. The alignment apparatus includes a supporting device for supporting the first layer and the second layer, a light pervious reference plate, and a viewing and adjusting mechanism. The light pervious reference plate has a first reference pattern spatially corresponding to the first alignment pattern on the first layer, and a second reference pattern spatially corresponding to the second alignment pattern on the second layer. The viewing and adjusting mechanism is adapted for assisting a human operator to align the first reference pattern with the first alignment pattern and the second reference pattern with the second alignment pattern.
Public/Granted literature
- US20090257036A1 ALIGNMENT APPARATUS FOR ALIGNING MULTI-LAYER STRUCTURES Public/Granted day:2009-10-15
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