Invention Grant
- Patent Title: Microelectromechanical device with thermal expansion balancing layer or stiffening layer
- Patent Title (中): 具有热膨胀平衡层或加强层的微机电装置
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Application No.: US12072090Application Date: 2008-02-22
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Publication No.: US08164821B2Publication Date: 2012-04-24
- Inventor: Sauri Gudlavalleti , Clarence Chui
- Applicant: Sauri Gudlavalleti , Clarence Chui
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: G02B26/00
- IPC: G02B26/00

Abstract:
An interferometric modulating device is provided with a thermal expansion balancing layer on a side of the movable flexible layer opposite the movable reflector such that when temperature changes the distance between the movable reflector and the optical stack does not change significantly, thereby leading to stable color. Additionally, an interferometric modulating device is provided with a stiffening layer between the movable flexible layer and the movable reflector and at least one hollow void exists on the surface where the movable reflector and the stiffening layer contact each other so that the movable reflector is more rigid to bending, thereby reducing the temperature sensitivity of the movable reflector.
Public/Granted literature
- US20090231666A1 Microelectromechanical device with thermal expansion balancing layer or stiffening layer Public/Granted day:2009-09-17
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