Invention Grant
US08164858B1 Read head having conductive filler in insulated hole through substrate
有权
在绝缘孔中通过衬底读头具有导电填料
- Patent Title: Read head having conductive filler in insulated hole through substrate
- Patent Title (中): 在绝缘孔中通过衬底读头具有导电填料
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Application No.: US12612575Application Date: 2009-11-04
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Publication No.: US08164858B1Publication Date: 2012-04-24
- Inventor: Mark D. Moravec , Subrata I Gusti Made , Santi Pumkrachang
- Applicant: Mark D. Moravec , Subrata I Gusti Made , Santi Pumkrachang
- Applicant Address: US CA Fremont
- Assignee: Western Digital (Fremont), LLC
- Current Assignee: Western Digital (Fremont), LLC
- Current Assignee Address: US CA Fremont
- Main IPC: G11B5/60
- IPC: G11B5/60

Abstract:
A novel read head includes a substrate having a trailing face and a leading face opposite the trailing face. The substrate includes a first hole therethrough that extends continuously from the trailing face to the leading face. The read head also includes a read transducer disposed on the trailing face, and a first plurality of electrically conductive trailing connection pads disposed on the trailing face. A first insulative layer is disposed on an inner surface of the first hole. A first electrically conductive filler is disposed in the first hole but is insulated from the substrate by the first insulative layer. A first electrically conductive leading connection pad is disposed on the leading face and is electrically connected to the first conductive filler.
Information query
IPC分类: