Invention Grant
US08164909B2 Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material
有权
Al / AlN接头材料，功率模块底板，电源模块及Al / AlN接头材料的制造方法
- Patent Title: Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material
- Patent Title (中): Al / AlN接头材料，功率模块底板，电源模块及Al / AlN接头材料的制造方法
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Application No.: US12784330Application Date: 2010-05-20
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Publication No.: US08164909B2Publication Date: 2012-04-24
- Inventor: Toshiyuki Nagase , Yoshiyuki Nagatomo , Kazuaki Kubo , Takeshi Negishi
- Applicant: Toshiyuki Nagase , Yoshiyuki Nagatomo , Kazuaki Kubo , Takeshi Negishi
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Materials Corporation
- Current Assignee: Mitsubishi Materials Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leason Ellis LLP.
- Priority: JP2004-110879 20040405; JP2004-221700 20040729
- Main IPC: H05K7/00
- IPC: H05K7/00 ; B23P9/00 ; B21D39/00 ; B32B3/00
Abstract:
A base plate for a power module includes: a metal plate, a ceramic base plate joined to the metal plate, and a release agent provided in a joint surface between the metal plate and the ceramic base plate. A remaining amount of the release agent is less than 5 as an amount of boron measured by fluorescence X-ray analysis, and a crystal grain straining region in the joint surface is equal to or less than 40%, or an amount of crystal grain straining in the joint surface is equal to or less than 0.03%.
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