Invention Grant
- Patent Title: System for electronic components mounted on a circuit board
- Patent Title (中): 安装在电路板上的电子元件系统
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Application No.: US11942308Application Date: 2007-11-19
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Publication No.: US08164915B2Publication Date: 2012-04-24
- Inventor: Jens Niemax
- Applicant: Jens Niemax
- Applicant Address: DE Munich
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE Munich
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H05K1/18
- IPC: H05K1/18
Abstract:
A system for electronic components mounted on a circuit board is disclosed. One embodiment provides placing an elastic, anisotropically conductive material on top of a printed circuit board. An electronic component is placed over the elastic, anisotropically conductive material, fixing the electronic component on the printed circuit board.
Public/Granted literature
- US20090129029A1 METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT Public/Granted day:2009-05-21
Information query
