Invention Grant
- Patent Title: Motherboard and relay device thereon
- Patent Title (中): 主板及继电器
-
Application No.: US12636767Application Date: 2009-12-13
-
Publication No.: US08164919B2Publication Date: 2012-04-24
- Inventor: Ming-Chih Hsieh
- Applicant: Ming-Chih Hsieh
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910308886 20091027
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
A motherboard includes a main body and two relay devices attached on the main body. The main body includes a signal output terminal, a signal input terminal, a first connector module, and a second connector module. Each relay device includes a circuit board, a relay, and a third connector module. The input terminal outputs an input signal to the corresponding relay via the first and the third connector modules in turn. The relay corresponding to the signal input terminal outputs the input signal to the signal output terminal via the third connector module corresponding to the signal input terminal, the first connector module, the second connector module and the third connector module corresponding to the signal output terminal in turn.
Public/Granted literature
- US20110096520A1 MOTHERBOARD AND RELAY DEVICE THEREON Public/Granted day:2011-04-28
Information query