Invention Grant
US08166445B1 Estimating Icc current temperature scaling factor of an integrated circuit
有权
估计集成电路的Icc当前温度比例因子
- Patent Title: Estimating Icc current temperature scaling factor of an integrated circuit
- Patent Title (中): 估计集成电路的Icc当前温度比例因子
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Application No.: US12558109Application Date: 2009-09-11
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Publication No.: US08166445B1Publication Date: 2012-04-24
- Inventor: Cinti X. Chen , Yongjun Zheng , Joe W. Zhao
- Applicant: Cinti X. Chen , Yongjun Zheng , Joe W. Zhao
- Applicant Address: US CA San Jose
- Assignee: Xilinx, Inc.
- Current Assignee: Xilinx, Inc.
- Current Assignee Address: US CA San Jose
- Agent LeRoy D. Maunu
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
An embodiment of the present invention reduces resources needed to estimate the Icc Current Temperature Scaling Factor (ITSF) of a device, and provides a method and apparatus to estimate ITSF from the device speed and performance characteristics which can be measured at room temperature. In one embodiment, a method for estimating the ITSF of an integrated circuit includes: determining a level of propagation delay of a portion of the integrated circuit; and determining an estimated Icc current temperature scaling factor from a correlation between the level of the propagation delay and a modeled Icc current temperature scaling factor.
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