Invention Grant
US08166445B1 Estimating Icc current temperature scaling factor of an integrated circuit 有权
估计集成电路的Icc当前温度比例因子

Estimating Icc current temperature scaling factor of an integrated circuit
Abstract:
An embodiment of the present invention reduces resources needed to estimate the Icc Current Temperature Scaling Factor (ITSF) of a device, and provides a method and apparatus to estimate ITSF from the device speed and performance characteristics which can be measured at room temperature. In one embodiment, a method for estimating the ITSF of an integrated circuit includes: determining a level of propagation delay of a portion of the integrated circuit; and determining an estimated Icc current temperature scaling factor from a correlation between the level of the propagation delay and a modeled Icc current temperature scaling factor.
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