Invention Grant
- Patent Title: Refrigeration system
- Patent Title (中): 制冷系统
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Application No.: US12305647Application Date: 2007-06-20
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Publication No.: US08166771B2Publication Date: 2012-05-01
- Inventor: Masakazu Okamoto
- Applicant: Masakazu Okamoto
- Applicant Address: JP Osaka
- Assignee: Daikin Industries, Ltd.
- Current Assignee: Daikin Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP.
- Priority: JP2006-171882 20060621
- International Application: PCT/JP2007/062431 WO 20070620
- International Announcement: WO2007/148727 WO 20071227
- Main IPC: F25B27/00
- IPC: F25B27/00
Abstract:
A heat source side circuit (14) includes a gas-liquid separator (35) for the separation of refrigerant flowing therein from an expander (31) into liquid refrigerant and gas refrigerant and a cooling means (36, 45, 53, 55) for the cooling of liquid refrigerant heading from the gas-liquid separator (35) to a utilization side circuit (11). Since the refrigerant exiting the gas-liquid separator (35) is in a saturated liquid form, it always changes state to a subcooled state whenever cooled by the cooling means (36, 45, 53, 55).
Public/Granted literature
- US20100000248A1 REFRIGERATION SYSTEM Public/Granted day:2010-01-07
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