Invention Grant
- Patent Title: Thin section preparing apparatus and thin section preparing method
- Patent Title (中): 薄型制备装置和薄型制备方法
-
Application No.: US12272398Application Date: 2008-11-17
-
Publication No.: US08166855B2Publication Date: 2012-05-01
- Inventor: Tetsumasa Ito , Koji Fujimoto
- Applicant: Tetsumasa Ito , Koji Fujimoto
- Applicant Address: JP Chiba
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP Chiba
- Agency: Brinks Hofer Gilson & Lione
- Priority: JP2007-302243 20071121
- Main IPC: B26D1/00
- IPC: B26D1/00 ; B26D7/06

Abstract:
A thin section preparing apparatus prepares a thin section from an embedded block having a biological sample embedded and carries the thin section. The thin section preparing apparatus includes a cutter, an approaching and separating mechanism, a carrying mechanism, a moving unit, a sliding mechanism and a control unit. The cutter slices the block at a pull angle. The approaching and separating mechanism relatively moves the block and the cutter along an approaching and separating direction. The carrying mechanism having a carrying body is arranged as one end side is near a nose, and the moving unit moves the body along a transport direction. The sliding mechanism relatively moves the block and the body along a moving direction. The control unit controls a combined velocity vector that combines a transport velocity vector of the body along the transport direction with a travel velocity vector of the body along the moving direction to be nearly equal to a block velocity vector of the embedded block along the approaching and separating direction.
Public/Granted literature
- US20090133556A1 THIN SECTION PREPARING APPARATUS AND THIN SECTION PREPARING METHOD Public/Granted day:2009-05-28
Information query