Invention Grant
US08167187B2 Method and device for producing a bondable area region on a carrier
有权
用于在载体上产生可结合区域的方法和装置
- Patent Title: Method and device for producing a bondable area region on a carrier
- Patent Title (中): 用于在载体上产生可结合区域的方法和装置
-
Application No.: US11415399Application Date: 2006-04-28
-
Publication No.: US08167187B2Publication Date: 2012-05-01
- Inventor: Reinhold Bayerer , Thomas Licht , Alfred Kemper
- Applicant: Reinhold Bayerer , Thomas Licht , Alfred Kemper
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Maginot, Moore & Beck
- Priority: DE102005020087 20050429
- Main IPC: B23K1/06
- IPC: B23K1/06
Abstract:
A method and a device is provided for levelling an area region on the surface of a metal or metallization layer of a carrier. The area region is made planar by the action of a stamp or of a roller.
Public/Granted literature
- US20060261133A1 Method and device for producing a bondable area region on a carrier Public/Granted day:2006-11-23
Information query
IPC分类:
