Invention Grant
- Patent Title: Apparatus and method for forming panel
- Patent Title (中): 用于形成面板的装置和方法
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Application No.: US12642083Application Date: 2009-12-18
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Publication No.: US08167606B2Publication Date: 2012-05-01
- Inventor: Seung Eun Yang
- Applicant: Seung Eun Yang
- Applicant Address: KR Chungcheongnamdo
- Assignee: Micro Contact Solution Co, Ltd.
- Current Assignee: Micro Contact Solution Co, Ltd.
- Current Assignee Address: KR Chungcheongnamdo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: KR10-2009-0029305 20090406
- Main IPC: B28B11/08
- IPC: B28B11/08 ; B65H45/14

Abstract:
Disclosed herein is an apparatus and method for forming a panel. The apparatus includes a first mold unit may include a right-angled upper mold provided on the front portion of an upper mold to reciprocate vertically, and a right-angled lower mold provided on the front portion of a lower mold, thus compressing base materials to impart a pattern of a right triangular waveform. A second mold unit may include an obtuse upper mold provided on the central portion of the upper mold to reciprocate in a direction inclined relative to a progressing direction of the base materials, and an obtuse lower mold provided on the central portion of the lower mold, thus compressing the base materials to impart a pattern of an obtuse triangular waveform. A third mold unit may be provided behind the second mold unit and linearly presses the base materials in a direction from front to rear.
Public/Granted literature
- US20100252954A1 APPARATUS AND METHOD FOR FORMING PANEL Public/Granted day:2010-10-07
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