An electronic device has: a connector having plural kinds of terminals with respectively different cross section shapes; and a substrate having a plurality of through-holes with lands formed therein. In the electronic device, a width W1 of an insertion portion of the first terminal, a width W2 of an insertion portion of the second terminal, a land-inclusive hole diameter D1 of the first through-hole, and a land-inclusive hole diameter D2 of the second through-hole are configured to fulfill conditions of W1 D2−D1, for the improvement of connection reliability between the land and the terminal while restraining dropping of reflow solder in a connector mounting process.