Described is an electronic connector. The electronic connector has a substrate body for housing electronic pins and a cable. The substrate body is fabricated from a first material, such as hard plastic and has at least one passage from its exterior to its interior. The overmold is fabricated from a resilient material having a lower melting point than the first material. The resilient material is overmolded onto the substrate body and flows through the at least one passage in the substrate body and forms a gasket on the connecting surface of the substrate body.