Invention Grant
- Patent Title: Polishing pad
- Patent Title (中): 抛光垫
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Application No.: US12440003Application Date: 2007-04-23
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Publication No.: US08167690B2Publication Date: 2012-05-01
- Inventor: Takeshi Fukuda , Satoshi Maruyama , Junji Hirose , Kenji Nakamura , Masato Doura
- Applicant: Takeshi Fukuda , Satoshi Maruyama , Junji Hirose , Kenji Nakamura , Masato Doura
- Applicant Address: JP Osaka-shi
- Assignee: Toyo Tire & Rubber Co., Ltd.
- Current Assignee: Toyo Tire & Rubber Co., Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Morrison & Foerster LLP
- Priority: JP2006-244418 20060908
- International Application: PCT/JP2007/058758 WO 20070423
- International Announcement: WO2008/029538 WO 20080313
- Main IPC: B24D11/00
- IPC: B24D11/00
Abstract:
A polishing pad of excellent durability has a polishing layer is arranged on a base material layer, and the polishing layer comprises a thermosetting polyurethane foam having roughly spherical interconnected cells with an average cell diameter of 35 to 300 μm.
Public/Granted literature
- US20100029182A1 POLISHING PAD Public/Granted day:2010-02-04
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