Invention Grant
US08168378B2 Substrate treatment system, substrate treatment method, and computer readable storage medium
有权
底物处理系统，底物处理方法和计算机可读存储介质
- Patent Title: Substrate treatment system, substrate treatment method, and computer readable storage medium
- Patent Title (中): 底物处理系统，底物处理方法和计算机可读存储介质
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Application No.: US12852855Application Date: 2010-08-09
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Publication No.: US08168378B2Publication Date: 2012-05-01
- Inventor: Takahisa Otsuka , Tsuyoshi Shibata
- Applicant: Takahisa Otsuka , Tsuyoshi Shibata
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-034089 20060210
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/26 ; G03F7/40
Abstract:
In the present invention, a plurality of heat treatment plates are provided side by side in a linear form on a base of a heat treatment apparatus in a coating and developing treatment system. In the heat treatment apparatus, three transfer member groups are provided which transfer a substrate in zones between adjacent heat treatment plates. At the time when performing a pre-baking treatment in the heat treatment apparatus, the substrate is transferred in order to the heat treatment plates at the same temperature, whereby the heat treatment is dividedly performed on the heat treatment plates. According to the present invention, substrates are subjected to heat treatment along the same route, so that the thermal histories are made uniform among the substrates.
Public/Granted literature
- US20100323306A1 SUBSTRATE TREATMENT SYSTEM, SUBSTRATE TREATMENT METHOD, AND COMPUTER READABLE STORAGE MEDIUM Public/Granted day:2010-12-23
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