Invention Grant
US08168464B2 Microelectronic assembly with an embedded waveguide adapter and method for forming the same
有权
具有嵌入式波导适配器的微电子组件及其形成方法
- Patent Title: Microelectronic assembly with an embedded waveguide adapter and method for forming the same
- Patent Title (中): 具有嵌入式波导适配器的微电子组件及其形成方法
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Application No.: US12692979Application Date: 2010-01-25
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Publication No.: US08168464B2Publication Date: 2012-05-01
- Inventor: Jinbang Tang
- Applicant: Jinbang Tang
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Ingrassia Fisher & Lorenz, PC
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A microelectronic assembly and a method for forming a microelectronic assembly are provided. A semiconductor substrate (22) is provided. The semiconductor substrate (22) has first and second opposing sides (24, 26) and first and second portions (28, 30). A tuning depression (32) is formed on the second opposing side and the second portion of the semiconductor substrate. A radio frequency conductor (34) is formed on the first opposing side (24) of the first semiconductor substrate. The radio frequency conductor (34) has a first end (46) on the first portion (28) of the first semiconductor substrate (22) and a second end (48) on the second portion (30) of the first semiconductor substrate (22). A microelectronic die (78) having an integrated circuit formed therein is attached to the first opposing side (24) and the first portion (28) of the semiconductor substrate (22) such that the integrated circuit is electrically connected to the first end (46) of the radio frequency conductor (34).
Public/Granted literature
- US20110180917A1 MICROELECTRONIC ASSEMBLY WITH AN EMBEDDED WAVEGUIDE ADAPTER AND METHOD FOR FORMING THE SAME Public/Granted day:2011-07-28
Information query
IPC分类:
