Invention Grant
- Patent Title: Semiconductor device having a semiconductor chip, and method for the production thereof
- Patent Title (中): 具有半导体芯片的半导体装置及其制造方法
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Application No.: US13270265Application Date: 2011-10-11
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Publication No.: US08168472B2Publication Date: 2012-05-01
- Inventor: Michael Bauer , Edward Fuergut
- Applicant: Michael Bauer , Edward Fuergut
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billlig & Czaja, PLLC
- Priority: DE102005046280 20050927
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A semiconductor device having a semiconductor chip having an active surface with flip-chip contacts and a passive surface is disclosed. In one embodiment, the flip-chip contacts are surrounded by an electrically insulating layer as underfill material, the layer having a UV B-stageable material. The UV B-stageable material is applied on the active surface of the semiconductor wafer.
Public/Granted literature
- US20120028382A1 SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR CHIP, AND METHOD FOR THE PRODUCTION THEREOF Public/Granted day:2012-02-02
Information query
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