Invention Grant
- Patent Title: Electronic part mounting board and method of mounting the same
- Patent Title (中): 电子部件安装板及其安装方法
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Application No.: US12039285Application Date: 2008-02-28
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Publication No.: US08168525B2Publication Date: 2012-05-01
- Inventor: Kouki Masuda
- Applicant: Kouki Masuda
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Pressser, PC
- Priority: JP2007-051267 20070301
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
An electronic part mounting board includes an insulating board, a pad formed on the insulating board, a bump formed on the pad, and a film having heat resistance and electrical insulating properties and formed on the insulating board except the pad and the bump. A method of mounting an electronic part on the mounting board is also disclosed.
Public/Granted literature
- US20080212301A1 ELECTRONIC PART MOUNTING BOARD AND METHOD OF MOUNTING THE SAME Public/Granted day:2008-09-04
Information query
IPC分类:
