Invention Grant
- Patent Title: Thermal recording adhesive label
- Patent Title (中): 热敏胶标签
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Application No.: US12366943Application Date: 2009-02-06
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Publication No.: US08168565B2Publication Date: 2012-05-01
- Inventor: Tohru Kitano
- Applicant: Tohru Kitano
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Cooper & Dunham LLP
- Priority: JP2008-033259 20080214
- Main IPC: B41M5/30
- IPC: B41M5/30 ; B41M5/40

Abstract:
A thermal recording adhesive label, including a substrate; a thermal recording layer located overlying one side of the substrate, including a leuco dye and a color developer; a back coat layer located overlying the other side of the substrate; an adhesive layer located overlying the back coat layer; and a release paper located overlying the adhesive layer, wherein the thermal recording adhesive label further includes an adhesive undercoat layer comprising a thermoplastic resin and a filler between the back coat layer and the adhesive layer.
Public/Granted literature
- US20090209419A1 THERMAL RECORDING ADHESIVE LABEL Public/Granted day:2009-08-20
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